Title:
METHOD FOR BONDING HIGH HEAT CONDUCTIVE INSULATING RESIN
Document Type and Number:
WIPO Patent Application WO/2010/134180
Kind Code:
A1
Abstract:
Provided is a method for bonding a high heat conductive insulating resin, by which the high heat conductive insulating resin can be bonded to a heat sink without deteriorating insulating characteristics and heat conducting characteristics. The method includes: a fixing step of fixing the heat sink by means of a jig having a vacuuming function; an arranging step of arranging the heat sink fixed by means of the jig on a sheet-like high heat conductive insulating resin previously bonded to a cooler and making a hermetically closed space; and a bonding step of having a bonding section between the heat sink and the sheet-like high heat conductive insulating resin under a negative pressure by depressurizing the hermetically closed space, heating the sheet-like high heat conductive insulating resin, and bonding the sheet-like high heat conductive insulating resin to the heat sink.
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Inventors:
YAMAMOTO REN (JP)
Application Number:
PCT/JP2009/059338
Publication Date:
November 25, 2010
Filing Date:
May 21, 2009
Export Citation:
Assignee:
TOYOTA MOTOR CO LTD (JP)
YAMAMOTO REN (JP)
YAMAMOTO REN (JP)
International Classes:
H01L23/36; H01L25/07; H01L25/18
Foreign References:
| JP2004087735A | 2004-03-18 | |||
| JP2007173338A | 2007-07-05 | |||
| JP2008166680A | 2008-07-17 | |||
| JP2004048084A | 2004-02-12 |
Other References:
See also references of EP 2434541A4
Attorney, Agent or Firm:
COSMOS PATENT OFFICE (JP)
Patent business corporation cosmos patent firm (JP)
Patent business corporation cosmos patent firm (JP)
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Claims: