METHOD OF FORMING CONDUCTING TRANSPARENT FILM, METHOD OF REPAIRING WIRING CONNECTION, AND APPARATUS FOR FORMING CONDUCTING TRANSPARENT FILM

Title:

METHOD OF FORMING CONDUCTING TRANSPARENT FILM, METHOD OF REPAIRING WIRING CONNECTION, AND APPARATUS FOR FORMING CONDUCTING TRANSPARENT FILM

Document Type and Number:

WIPO Patent Application WO/2000/065611

Kind Code:

A1

Abstract:

A particular area (27b) of an object (27) is irradiated with an energy beam (29) in a gaseous atmosphere containing an indium compound and a tin compound, so that conducting transparent film (27c) is deposited on the irradiated area (27b).

Inventors:

HAGIWARA RYOJI (JP)
KOYAMA YOSHIHIRO (JP)

Application Number:

PCT/JP2000/002559

Publication Date:

November 02, 2000

Filing Date:

April 19, 2000

Export Citation:

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Assignee:

SEIKO INSTR INC (JP)
HAGIWARA RYOJI (JP)
KOYAMA YOSHIHIRO (JP)

International Classes:

C23C16/04; H01L21/285; H01L21/768; H01L31/0224; (IPC1-7): H01B13/00

Foreign References:

JPH04276078A	1992-10-01
JPS6362109A	1988-03-18
JPS61158136A	1986-07-17
JPH0964030A	1997-03-07
JPH10163201A	1998-06-19
JPH0394054A	1991-04-18

Attorney, Agent or Firm:

Hayashi, Keinosuke (Sendabori Matsudo-shi, Chiba, JP)

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