Title:
METHOD FOR MANUFACTURING HYDRAULIC INJECTION MOLDING DEVICE, AND DRIVE CONTROL APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/117250
Kind Code:
A1
Abstract:
According to the present invention, when a deceleration start point Xs is reached, a deceleration control process is started by controlling the flow rate of a meter-in side of a hydraulic driving actuator 3. The movement position of a movable unit 4 is detected, and meter-in control of the hydraulic driving actuator 3 is performed by a speed command corresponding to the movement position. At the same time, the movement position of the movable unit 4 is detected, and the movement speed of the movable unit 4 is obtained. Feedback control by means of a meter-out control of the hydraulic driving actuator 3 is performed so that the movement speed matches the speed command.
More Like This:
Inventors:
MIYAZAKI HIROYUKI (JP)
SAKAKI SATOMI (JP)
HAYASHI KENICHI (JP)
KOMAMURA ISAMU (JP)
SAKAKI SATOMI (JP)
HAYASHI KENICHI (JP)
KOMAMURA ISAMU (JP)
Application Number:
PCT/JP2017/046083
Publication Date:
June 28, 2018
Filing Date:
December 22, 2017
Export Citation:
Assignee:
NISSEI PLASTICS IND CO (JP)
International Classes:
B29C45/76; B22D17/26; B29C45/67
Foreign References:
JPH08114203A | 1996-05-07 | |||
JPH11235741A | 1999-08-31 | |||
JP2011110700A | 2011-06-09 | |||
JP2009202365A | 2009-09-10 | |||
JPH05285956A | 1993-11-02 |
Attorney, Agent or Firm:
SHIMODA Shigeru (JP)
Download PDF:
Previous Patent: ORAL IBUPROFEN PREPARATION
Next Patent: SEMICONDUCTOR LASER MODULE AND PRODUCTION METHOD FOR SEMICONDUCTOR LASER MODULE
Next Patent: SEMICONDUCTOR LASER MODULE AND PRODUCTION METHOD FOR SEMICONDUCTOR LASER MODULE