METHOD FOR MANUFACTURING RESIN MULTILAYER SUBSTRATE, RESIN MULTILAYER SUBSTRATE, AND MOUNTING STRUCTURE OF RESIN MULTILAYER SUBSTRATE

WIPO Patent Application WO/2018/211883

A1

A method for manufacturing a resin multilayer substrate (101) includes a conductor forming step, a laminate forming step, and a cutting step. In the conductor forming step, inner conductor patterns (31, 32, 33) and mounting electrodes (P1, P2) are formed on a plurality of insulating base material layers (11, 12, 13) made mainly of a resin material. In the laminate forming step, after the conductor forming step, the laminated plurality of insulating base material layers (11, 12, 13) are heated and pressurized, the mounting electrodes (P1, P2) are arranged on the surface of the laminate, and the inner conductor patterns (31, 32, 33) are arranged inside of the laminate. In the cutting step, after the laminate forming step, a portion, in which the mounting electrodes (P1, P2) and the inner conductor patterns (31, 32, 33) overlap each other when viewed from the lamination direction (Z axis direction) of the plurality of insulating base material layers (11, 12, 13), is cut with a laser to form reattachment films (AF1, AF2) of the resin material on end faces (SS1, SS2) of the cut laminate (10).

ITO SHINGO (JP)
YOSUI KUNIAKI (JP)

PCT/JP2018/015688

November 22, 2018

April 16, 2018

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MURATA MANUFACTURING CO (JP)

H05K3/00; H05K3/46

JPS62163390A	1987-07-20
JP2009099661A	2009-05-07
JP2002036255A	2002-02-05
JP2006332255A	2006-12-07
JP2010129722A	2010-06-10
JPH04196291A	1992-07-16

KAEDE PATENT ATTORNEYS' OFFICE (JP)

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