Title:
METHOD FOR POLISHING WORK PIECE, AND DEVICE FOR POLISHING WORK PIECE
Document Type and Number:
WIPO Patent Application WO/2016/021094
Kind Code:
A1
Abstract:
Provided is a method for polishing a work piece, whereby the amount of polishing of the work piece can be controlled with higher precision. In this method for polishing a work piece, a work piece (20) is held between an upper surface plate (50a) and a lower surface plate (50b), the distance between the center of the work piece and the center of the upper surface plate (50a) and the lower surface plate (50b) periodically changes with each rotation of a carrier plate (30), and front and back surfaces of the work piece (20) are polished simultaneously, and the method for polishing a work piece is characterized in that a torque is measured, the amount of polishing of the work piece (20) is controlled on the basis of the amplitude of a torque component caused by the periodic change in the distance, an opening (H) is provided in the carrier plate (30) in a portion thereof excluding a retaining hole (40), and the open area ratio of the carrier plate (30) is 55% or less.
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Inventors:
IWANAGA TAKAYA (JP)
MIURA TOMONORI (JP)
MIURA TOMONORI (JP)
Application Number:
PCT/JP2015/002461
Publication Date:
February 11, 2016
Filing Date:
May 15, 2015
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B37/28; B24B49/16; H01L21/304
Domestic Patent References:
| WO2014002467A1 | 2014-01-03 |
Foreign References:
| JP2004283929A | 2004-10-14 | |||
| JPH10180623A | 1998-07-07 | |||
| JP2004146471A | 2004-05-20 | |||
| JP2002254299A | 2002-09-10 | |||
| JP2009039827A | 2009-02-26 | |||
| JP2013502719A | 2013-01-24 |
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
Kenji Sugimura (JP)
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