Title:
METHOD FOR PREPARING REFRIGERANT, AND REFRIGERANT
Document Type and Number:
WIPO Patent Application WO/2023/199944
Kind Code:
A1
Abstract:
A method for preparing a refrigerant that comprises adding an additive to a refrigerant at such a composition and concentration as to satisfy the following requirements: when a preset heat quantity Qin[W] is applied to a heat diffusion board from a cooling object, having such a value of thermal conductivity kr[Wm-1K-1] in the plane direction that satisfies the value of biot number to be achieved, and such a value of thermal conductivity kz[Wm-1K-1] in the thickness direction that satisfies the thermal resistance to be achieved, for suppressing the temperature Tin[K] of the heat-receiving part of the heat diffusion board and the in-plane temperature irregularity ΔT[K] of the heat diffusion board respectively not more than specified values Tin.C[K] and ΔTc[K]; the values of the thermal conductivity in the plane direction kr[Wm-1K-1] and the thermal conductivity in the thickness direction kz[Wm-1K-1] being maintained within the range of the values to be achieved, even when the heat diffusion board is repeatedly exposed to temperatures ranging from the freezing point of water or below to the boiling point of water or above; and the values being maintained within the range to be achieved even when the heat diffusion board is exposed to a high temperature of 150°C or above.
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Inventors:
NAKAYAMA TOORU (JP)
FUKUNAGA RINKOU (JP)
NAKAYAMA RIKA (JP)
MIZUTA KEI (JP)
FUKUNAGA RINKOU (JP)
NAKAYAMA RIKA (JP)
MIZUTA KEI (JP)
Application Number:
PCT/JP2023/014858
Publication Date:
October 19, 2023
Filing Date:
April 12, 2023
Export Citation:
Assignee:
MONATEC CO LTD (JP)
UNIV KAGOSHIMA (JP)
UNIV KAGOSHIMA (JP)
International Classes:
C09K5/04; F28D15/02
Domestic Patent References:
| WO2022080073A1 | 2022-04-21 |
Foreign References:
| JP6539862B2 | 2019-07-10 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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