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Title:
METHOD FOR PRODUCING ELECTRICAL WIRE PROTECTING STRUCTURE AND ELECTRICAL WIRE PROTECTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/132570
Kind Code:
A1
Abstract:
This method for producing an electrical wire protecting structure suppresses unevenness in the shape of a thermoplastic material covering a wire bundle. The method for producing an electrical wire protecting structure is provided with: (a) a step for covering a wire bundle by winding a sheet-shaped nonwoven material around the wire bundle; (b) a step for holding the form of having wound around the wire bundle in step (a) by means of adhering the sheet-shaped nonwoven material to the outer periphery of the wire bundle or the outer periphery of the sheet-shaped nonwoven material already wound around the wire bundle; and (c) a step for heating and compressing to mold the sheet-shaped nonwoven material held in the state of being wound around the wire bundle in step (b).

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Inventors:
IGARASHI SHINICHI (JP)
TAKIHARA NOBUMASA (JP)
SHIRAFUJI YUKIHIRO (JP)
TANIGAWA SATOSHI (JP)
YAMAGIWA MASAMICHI (JP)
MURATA ATSUSHI (JP)
SATOU OSAMU (JP)
Application Number:
PCT/JP2012/055508
Publication Date:
September 12, 2013
Filing Date:
March 05, 2012
Export Citation:
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Assignee:
SUMITOMO WIRING SYSTEMS (JP)
IGARASHI SHINICHI (JP)
TAKIHARA NOBUMASA (JP)
SHIRAFUJI YUKIHIRO (JP)
TANIGAWA SATOSHI (JP)
YAMAGIWA MASAMICHI (JP)
MURATA ATSUSHI (JP)
SATOU OSAMU (JP)
International Classes:
H02G3/04; H01B13/012
Foreign References:
JP2012039782A2012-02-23
JP2011223743A2011-11-04
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Hidetoshi Yoshitake (JP)
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Claims:



 
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