Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/132569
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a semiconductor device wherein the service-life of a solder bonded portion of an electronic component is improved. This semiconductor device is characterized in that: the semiconductor device is provided with a ceramic (1), an upper pattern (2) formed on the ceramic (1), and a resistor (4) connected on the upper pattern (2) with a solder (5) therebetween; and the upper pattern (2) has a portion connected to the resistor (4) with the solder (5) therebetween formed in a recessed shape.
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Inventors:
HAYASHIDA YUKIMASA (JP)
Application Number:
PCT/JP2012/055507
Publication Date:
September 12, 2013
Filing Date:
March 05, 2012
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
HAYASHIDA YUKIMASA (JP)
HAYASHIDA YUKIMASA (JP)
International Classes:
H05K3/34; H01L25/00
Foreign References:
| JPS63100871U | 1988-06-30 | |||
| JPH0537105A | 1993-02-12 | |||
| JP2008010617A | 2008-01-17 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Hidetoshi Yoshitake (JP)
Hidetoshi Yoshitake (JP)
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Claims:
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