Title:
METHOD FOR PRODUCING METAL PLATE LOW-RESISTANCE CHIP RESISTOR
Document Type and Number:
WIPO Patent Application WO/2012/039020
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for producing a metal plate low-resistance chip resistor for which a protective film can be formed easily without being affected by the width of the metal plate resistor at the stripe shaped parts and for which the protective film width can be adjusted according to the variations in thickness in the direction of the width of the metal plate resistor. The purpose is also for the metal plate low-resistance chip resistor to have increased freedom in adjustment of the width of the protective film. To do so, a protective film forming step (step S13) that forms a protective film on the front surface and back surface of a metal plate resistor is carried out first and a slit forming step (step S14) that forms a slit in the metal plate resistor and forms the metal plate resistor into a shape having the stripe shaped parts and connecting parts is carried out thereafter. In addition, a metal plate resistor thickness measurement step (step 12) that measures the thickness at various positions along the width of the metal plate resistor for which the protective film is formed is carried out before the protective film forming step (step S13), and in the protective film forming step (step S13), the width of the protective film is set according to the thickness at each position that has been measured along the width of the metal plate resistor.
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Inventors:
HIRANO TATSUKI (JP)
Application Number:
PCT/JP2010/066313
Publication Date:
March 29, 2012
Filing Date:
September 21, 2010
Export Citation:
Assignee:
KAMAYA ELECTRIC CO LTD (JP)
HIRANO TATSUKI (JP)
HIRANO TATSUKI (JP)
International Classes:
H01C17/00; H01C3/00
Foreign References:
| JP2007049070A | 2007-02-22 | |||
| JP2009218552A | 2009-09-24 |
Attorney, Agent or Firm:
MITSUISHI Toshiro et al. (JP)
Toshiro Mitsuishi (JP)
Toshiro Mitsuishi (JP)
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Claims: