Title:
METHOD FOR PRODUCING SEMICONDUCTOR COMPONENT AND APPARATUS FOR PRODUCING SEMICONDUCTOR COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/042784
Kind Code:
A1
Abstract:
The present invention provides a production method and a production apparatus, each of which is capable of producing a plurality of semiconductor components from one lead frame. The semiconductor components each have: a resin portion 21 in which a semiconductor chip is sealed with a resin; and a plurality of lead parts 22 which protrudes in a common direction from one surface of the resin portion 21. A method for producing a semiconductor component according to the present invention comprises: a step in which a lead frame 3 that is provided with a plurality of resin portions 21 is cut so as to separate the plurality of resin portions 21 into individual pieces; and a step in which the lengths of the plurality of lead parts 22 that protrude from each individualized resin portion 21 are extended. With respect to the lead frame 3, the protrusion surface of one resin portion 21, from the protrusion surface the lead parts 22 protruding, and the protrusion surface of another resin portion 21 face each other; and the protrusion ends of two lead parts 22 respectively protruding from the two protrusion surfaces, which face each other, are connected to each other.
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Inventors:
KANAMARU HIROYUKI (JP)
Application Number:
PCT/JP2023/017240
Publication Date:
February 29, 2024
Filing Date:
May 08, 2023
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
H01L23/48; H01L21/56
Foreign References:
| JP2000012752A | 2000-01-14 | |||
| JPH06132449A | 1994-05-13 | |||
| JP2018017545A | 2018-02-01 | |||
| US20210225744A1 | 2021-07-22 | |||
| JP2008042039A | 2008-02-21 | |||
| JPH08148643A | 1996-06-07 | |||
| JP2014086536A | 2014-05-12 | |||
| JPH1022436A | 1998-01-23 |
Attorney, Agent or Firm:
MIKAMI Yoko (JP)
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