Title:
METHOD OF SEPARATING PLATE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2006/085652
Kind Code:
A1
Abstract:
A method of separating plate materials capable of completely separating the plate materials with large areas without using a peeling member and eliminating the possibility of occurrence of permanent deformation on the plate materials. A plurality of suction pads (3) are suckingly disposed on the surface of the uppermost plate material (W1) in a roughly lattice shape. Next, while the uppermost plate material (W1) is held by the suction pads disposed in a staggered shape among the suction pads (3) disposed in the roughly lattice shape, the uppermost plate material (W1) is raised by the remaining suction pads (3). Lastly, the suction pads (3) holding the uppermost plate material (W1) are raised.
Inventors:
MARUYAMA MANABU (JP)
NAKAGAWA YOSHIAKI (JP)
NAKAO KEIICHIRO (JP)
NAKAGAWA YOSHIAKI (JP)
NAKAO KEIICHIRO (JP)
Application Number:
PCT/JP2006/302476
Publication Date:
August 17, 2006
Filing Date:
February 13, 2006
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
MARUYAMA MANABU (JP)
NAKAGAWA YOSHIAKI (JP)
NAKAO KEIICHIRO (JP)
MARUYAMA MANABU (JP)
NAKAGAWA YOSHIAKI (JP)
NAKAO KEIICHIRO (JP)
International Classes:
B21D43/24; B21D43/18; B65H3/08
Foreign References:
| JPH02135549U | 1990-11-09 | |||
| JPH06179534A | 1994-06-28 | |||
| JPH05306030A | 1993-11-19 | |||
| JP2001252732A | 2001-09-18 | |||
| JPS61229731A | 1986-10-14 | |||
| JPS4731374A |
Attorney, Agent or Firm:
Kitamura, Kinichi (16-1 Shinbashi 2-chom, Minato-Ku Tokyo 04, JP)
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