Title:
MICRONEEDLE STRUCTURE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/211059
Kind Code:
A1
Abstract:
This microneedle structure 10 comprises needle-shaped sections 12 on one surface side of a substrate 11, the substrate 11 is permeable by a liquid in the thickness direction, the needle-shaped sections 12 are formed from a composition including a low-melting-point resin with a melting point of 150ºC or less, and holes 13 are formed in the surface and the interior of the needle-shaped sections 12. In addition, a method for producing the microneedle structure 10 includes a bonding step in which the composition including a low-melting-point-resin with a melting point of 150ºC or less is heated and the heated low-melting-point resin and the substrate 11 are bonded. In this way, the present invention provides a microneedle structure and a method for producing the microneedle structure in which the effect of high temperatures on a substrate is reduced and there is a high degree of freedom in terms of the selection of the substrate.
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Inventors:
KOMA YOSUKE (JP)
Application Number:
PCT/JP2022/016676
Publication Date:
October 06, 2022
Filing Date:
March 31, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
A61M37/00; A61B5/145; A61B5/151; A61B5/153
Domestic Patent References:
WO2019176126A1 | 2019-09-19 |
Foreign References:
KR20150085502A | 2015-07-23 | |||
JP2017000724A | 2017-01-05 | |||
US20100048744A1 | 2010-02-25 | |||
JP2015128499A | 2015-07-16 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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