Title:
MODULAR HEATING FLOOR
Document Type and Number:
WIPO Patent Application WO/2017/059764
Kind Code:
A1
Abstract:
A modular heating floor, including a central portion and a peripheral portion, consists of module units (45) and lace units (46). A plurality of module units (45) are jointed, through a positioning mortise (21), a positioning strip (22), a connecting screw (36) and an embedded nut (38), to form the center portion of the modular heating floor, and a plurality of lace units (46) are jointed, through a lace tenon (27), a plug strip (26), a connecting screw (36), an embedded nut (38) and a fixing screw (49), to form the peripheral portion of the modular heating floor. A floor heating water pipe through groove (11) or a floor heating cable through groove (12) is provided inside the modular heating floor, wherein a floor heating water pipe (43) is placed in the floor heating water pipe through groove (11), or a floor heating cable (44) is placed in the floor heating cable through groove (12), a pipeline channel (52) is arranged all around, and the bottom is disposed with an elastic cushion block (40), which is fixed with a foot screw (41) or directly lays on the ground or floor. The modular heating floor tackles the issues of poor fit and prone-to-deformation, static visual effect, low comfort, noisy when walked upon, low heat utilization and difficulties maintenance, etc.
More Like This:
Inventors:
LI CHENGJUN (CN)
Application Number:
PCT/CN2016/099231
Publication Date:
April 13, 2017
Filing Date:
September 18, 2016
Export Citation:
Assignee:
LI CHENGJUN (CN)
International Classes:
E04F15/04
Foreign References:
CN105113759A | 2015-12-02 | |||
CN205046806U | 2016-02-24 | |||
CN2214467Y | 1995-12-06 | |||
CN203257047U | 2013-10-30 | |||
CN104100011A | 2014-10-15 | |||
CN201087525Y | 2008-07-16 | |||
GB2312994A | 1997-11-12 | |||
JP2014070329A | 2014-04-21 |
Attorney, Agent or Firm:
BEIJING EASTKING PATENT AGENT FIRM (CN)
Download PDF:
Previous Patent: SIGNAL TRANSMISSION METHOD AND DEVICE
Next Patent: ELECTRONIC BILL SENDING METHOD AND APPARATUS
Next Patent: ELECTRONIC BILL SENDING METHOD AND APPARATUS