Title:
MOLDED ARTICLE FOR HOLDING WAFER
Document Type and Number:
WIPO Patent Application WO/1991/001044
Kind Code:
A1
Abstract:
A molded article for holding a wafer, which is made of a thermoplastic resin reinforced with whiskers and used for handling a wafer and a glass sheet for a liquid crystal television set, such as a transfer basket, a storage case, a carrier jig, and the like. It is useful for washing, drying, moving or storing a semiconductor wafer free of contamination.
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Inventors:
TABUCHI AKIRA (JP)
NAKAMURA MORIHIKO (JP)
NAKAMURA MORIHIKO (JP)
Application Number:
PCT/JP1990/000863
Publication Date:
January 24, 1991
Filing Date:
July 04, 1990
Export Citation:
Assignee:
OTSUKA KAGAKU KK (JP)
International Classes:
C08K7/08; B65D85/86; C08K9/02; C08L23/10; H01L21/673; H01L21/68; (IPC1-7): H01L21/68
Foreign References:
| JPS58168638A | 1983-10-05 | |||
| JPS5949256A | 1984-03-21 | |||
| JPS6023446A | 1985-02-06 | |||
| JPS6096649A | 1985-05-30 | |||
| JPS60106807A | 1985-06-12 |
Other References:
See also references of EP 0436030A4
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