MOLDING DEVICE

WIPO Patent Application WO/2013/145307

A1

[Problem] To prevent occurrences of abrasion marks on the outside surface of material that has undergone molding processing between revolving units in a molding device that carries out a molding process for material to be molded between a pair of the revolving units in which an endless mold row moves in a revolving motion on an endless track, said endless mold row being constituted by connecting mold units (9), in which hole forms (11) for molding molds (10) are oriented outward, in an endless row. To achieve this, mutually latching parts (12b, 12c) that prevent positional offsetting with respect to each other of the adjacent mold units (9) in the endless mold row in the circumferential direction within a plane at a right angle to the direction of movement during movement between the revolving units are provided on the two sides of each mold unit (9). Edge parts of the hole forms (11) in the molds (10) are rounded at the end parts in the direction of movement of the units.

WANG FEIZHOU (JP)
NAKANO TOMOYASU (JP)
INOKUMA AKINORI (JP)
YIN JILONG (JP)
AKAI TERUTOMO (JP)
AKIYAMA MASAYOSHI (JP)
UCHIMURA TAKASHI (JP)

PCT/JP2012/058723

October 03, 2013

March 30, 2012

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NAKATA MFG CO LTD (JP)
NAT UNIV CORP KYOTO INST TECH (JP)
WANG FEIZHOU (JP)
NAKANO TOMOYASU (JP)
INOKUMA AKINORI (JP)
YIN JILONG (JP)
AKAI TERUTOMO (JP)
AKIYAMA MASAYOSHI (JP)
UCHIMURA TAKASHI (JP)

B21D5/10; B21C37/08

WO2009110372A1

2009-09-11

JP2011050986A	2011-03-17
JPS5551648B2	1980-12-25
JPS4318276B

YANAGIDATE TAKAHIKO (JP)
Takahiko Yanagidate (JP)

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