MOUNTING BOARD, LIGHT EMITTING DEVICE AND LAMP

WIPO Patent Application WO/2012/053134

A1

A mounting board (10) with translucency and a surface whereupon an LED (20) is mounted, and having a sintered body film (12) including a wavelength converting material for converting wavelength of light and a bonding material for sintering formed of an inorganic material. The wavelength converting material converts wavelength of light that travels in a direction toward the surface whereupon the LED (20) is mounted among light emitted from the LED (20) to emit a wavelength converted light. The bonding material for sintering transmits light emitted from the LED (20) and the wavelength converted light.

JP2013115377	LIGHT RADIATION DEVICE, LIGHT RADIATION MODULE, AND PRINTER
WO/2022/115794	LOW RESISTANCE CURRENT SPREADING TO N-CONTACTS OF MICRO-LED ARRAY
WO/2007/135754	PROCESS FOR MANUFACTURING LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE

MOTOYA ATSUSHI
OKANO KAZUYUKI
OKAZAKI TORU
TAGAMI NAOKI
OMURA KOJI
TAKEUCHI NOBUYOSHI
MATSUDA TSUGIHIRO
HORIUCHI MAKOTO

PCT/JP2011/003611

April 26, 2012

June 24, 2011

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PANASONIC CORP (JP)
MOTOYA ATSUSHI
OKANO KAZUYUKI
OKAZAKI TORU
TAGAMI NAOKI
OMURA KOJI
TAKEUCHI NOBUYOSHI
MATSUDA TSUGIHIRO
HORIUCHI MAKOTO

H01L33/58

JP2008166740A	2008-07-17
JP2007299997A	2007-11-15
JP2008021868A	2008-01-31
JP2004186109A	2004-07-02
JP2006313717A	2006-11-16
JP2009043447A	2009-02-26

NII, Hiromori (JP)
New house Extensive 守 (JP)

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