Title:
ONE-CHIP TYPE LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/190090
Kind Code:
A1
Abstract:
Disclosed are a one-chip type light emitting element and a manufacturing method therefor according to the present invention. A manufacturing method for a one-chip type light emitting element according to an embodiment of the present invention comprises the steps of: growing a light emitting layer on a growth substrate; forming a first metal layer on the light emitting layer; attaching a jig on the first metal layer and removing the growth substrate; forming a second metal layer below the light emitting layer; removing the jig from the first metal layer to form a light emitting structure; and dicing the light emitting structure into a predetermined size to form a light emitting element in which respective layers are horizontally arranged.
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Inventors:
MIN JAE SIK (KR)
LEE JAE YEOP (KR)
CHO BYUNG GU (KR)
LEE JAE YEOP (KR)
CHO BYUNG GU (KR)
Application Number:
PCT/KR2019/003033
Publication Date:
October 03, 2019
Filing Date:
March 15, 2019
Export Citation:
Assignee:
LIGHTIZER CO LTD (KR)
International Classes:
H01L33/00; H01L21/76; H01L27/15; H01L33/26; H01L33/62
Foreign References:
| JPH06326365A | 1994-11-25 | |||
| KR20160059576A | 2016-05-27 | |||
| KR20100055747A | 2010-05-27 | |||
| US20070042520A1 | 2007-02-22 | |||
| JP2006041077A | 2006-02-09 |
Attorney, Agent or Firm:
PARK, Yang Ho (KR)
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