Title:
OPTICAL SENSOR PACKAGE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/216834
Kind Code:
A1
Abstract:
Disclosed are an optical sensor package and a method for manufacturing the same. The optical sensor package according to the present invention is a light-receiving sensor package for sensing light reflected from the surface of an object to be sensed, and can contribute to slimness of the electronic device on which the same is mounted. The optical sensor package according to the present invention comprises: a base board; a sensor chip which is coupled to the upper surface of the base board, and which comprises a light-receiving surface; a molding portion formed so as to cover a part of the sensor chip on the upper surface of the base board and not to cover the light-receiving surface; an optical filter covering the light-receiving surface; and a flexible circuit board coupled to the lower surface of the base board.
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Inventors:
JEON MUN SU (KR)
LEE HYUN JIN (KR)
LEE JAE JEONG (KR)
LEE HYUN JIN (KR)
LEE JAE JEONG (KR)
Application Number:
PCT/KR2017/005492
Publication Date:
November 29, 2018
Filing Date:
May 26, 2017
Export Citation:
Assignee:
PARTRON CO LTD (KR)
International Classes:
H01L31/08; H01L31/0232; H01L31/048; H01L31/18
Foreign References:
| JP2016524329A | 2016-08-12 | |||
| JP2006194791A | 2006-07-27 | |||
| JPH10189627A | 1998-07-21 | |||
| KR20120134080A | 2012-12-11 | |||
| US20050285016A1 | 2005-12-29 |
Attorney, Agent or Firm:
SHIN, Yong Hyun et al. (KR)
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