Title:
PACKAGE STRUCTURE, MANUFACTURING METHOD FOR PACKAGE STRUCTURE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/067830
Kind Code:
A1
Abstract:
Provided in the present application are a package structure, a manufacturing method for the package structure, and an electronic device. The package structure comprises a substrate and an electronic component arranged on the substrate. Conductive through vias are formed in a side surface of the substrate, and conductive members are provided in the conductive through vias. The electronic component is wrapped in a molding layer, a molding trench surrounding the periphery of the electronic component is formed in the molding layer, and the molding layer comprises a shielding area located inside the molding trench. The package structure further comprises a shielding layer covering the shielding area. Antennas are provided on side surfaces of the molding layer, and the antennas are electrically connected to the conductive members.
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Inventors:
HU WENHUA (CN)
Application Number:
PCT/CN2023/122748
Publication Date:
April 04, 2024
Filing Date:
September 28, 2023
Export Citation:
Assignee:
QINGDAO GOERTEK MICROELECTRONICS RES INSTITUTE CO LTD (CN)
International Classes:
H01L23/552; H01L21/56; H01L23/31; H01L23/66; H01Q1/22
Foreign References:
| CN115939109A | 2023-04-07 | |||
| CN106971989A | 2017-07-21 | |||
| CN103050482A | 2013-04-17 | |||
| CN102324416A | 2012-01-18 |
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (CN)
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