PATTERN MEASURING APPARATUS AND PATTERN MEASURING METHOD

WIPO Patent Application WO/2010/073360

A1

Provided is a pattern measuring apparatus and a pattern measuring method which can correctly measure the length of a pattern even if the width of an edge portion of the pattern is narrower than a beam diameter. The pattern measuring apparatus is equipped with a beam intensity distribution creating section which scans a reference pattern with the edge portion formed at right angles using a charged particle beam to create a line profile and then creates the intensity distribution of a reference beam, an edge width detecting section which obtains a line profile of a model of patterns with the edge formed at various inclination angles using the intensity distribution of the reference beam and calculates the edge width of the model, considering an influence of the width of the reference beam, and a correspondence table creating section which calculates correction values for the edge positions from the calculated edge width and the model of patterns. The intensity distribution of the reference beam is created by synthesizing the portions of the intensity distributions on the side where no pattern is formed, at the rising point and the falling point of the reference pattern.

JPH06105605	[Title of Invention] Image Observation Device for Electron Microscope
JP6488073	Stage device and charged particle beam device using it
JP4841407	electronic microscope

MATSUMOTO JUN (JP)

PCT/JP2008/073708

July 01, 2010

December 26, 2008

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ADVANTEST CORP (JP)
MATSUMOTO JUN (JP)

H01J37/22; G01B15/00; H01L21/66

JP2005228560A	2005-08-25
JP2005156436A	2005-06-16
JP2003121132A	2003-04-23
JPS622116A	1987-01-08
JPS61290313A	1986-12-20

OKAMOTO, KEIZO (JP)
Keizo Okamoto (JP)

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