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Patent Searching and Data


Title:
PATTERN SHAPE SELECTION METHOD AND PATTERN MEASURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/013316
Kind Code:
A1
Abstract:
Proposed are a pattern shape selection method and a pattern measuring device whereby it is possible to appropriately estimate the shape on the basis of comparison between actual waveforms and library data. As an illustrative embodiment of the above, there are proposed a method and a device whereby a library is referred to with respect to waveforms obtained, thereby selecting the shape of a pattern. The aforementioned method and device are such that waveform information is obtained under a plurality of waveform acquisition conditions on the basis of irradiation of specimens with charged particle beams, and that with respect to the resulting plurality of pieces of waveform information, reference is made to a library wherein there is memorized waveform information obtained under different waveform acquisition conditions for a plurality of pattern shapes, and that thereby a pattern shape memorized in the aforementioned library is selected.

Inventors:
TANAKA MAKI (JP)
SHISHIDO CHIE (JP)
NAGATOMO WATARU (JP)
OSAKI MAYUKA (JP)
Application Number:
PCT/JP2010/004587
Publication Date:
February 03, 2011
Filing Date:
July 15, 2010
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP (JP)
TANAKA MAKI (JP)
SHISHIDO CHIE (JP)
NAGATOMO WATARU (JP)
OSAKI MAYUKA (JP)
International Classes:
G01B15/04; G01N23/225; H01L21/66
Foreign References:
JP2007218711A2007-08-30
JP2005156436A2005-06-16
JP2005189137A2005-07-14
JP2009117691A2009-05-28
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
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