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Title:
PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/118619
Kind Code:
A1
Abstract:
A photosensitive polyimide resin composition comprising a closed-ring polyimide resin (A) having a structure represented by formula (1) and having a weight average molecular weight of 70,000 or less, and a polyfunctional radically polymerizable compound (B) having 4-100 radically polymerizable functional groups.

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Inventors:
SATO YUMI (JP)
MIYAHARA DAICHI (JP)
UMEKI MIHO (JP)
Application Number:
PCT/JP2021/041279
Publication Date:
June 09, 2022
Filing Date:
November 10, 2021
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F290/06; C08G73/10; G03F7/004; G03F7/027
Domestic Patent References:
WO2006064867A12006-06-22
WO2017159876A12017-09-21
WO2021187355A12021-09-23
WO2018180592A12018-10-04
WO2019189110A12019-10-03
Foreign References:
JP2018070829A2018-05-10
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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