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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING SUBSTRATE WITH RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/100640
Kind Code:
A1
Abstract:
A photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator, and wherein: the binder polymer contains a binder polymer that has a structural unit derived from a (meth)acrylic acid; and the photopolymerizable compound contains a bisphenol A di(meth)acrylate and a compound that has a caprolactone structure and two or more polymerizable unsaturated bonds.

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Inventors:
MOMOZAKI AYA (JP)
OKADE SHOTA (JP)
Application Number:
PCT/JP2016/085412
Publication Date:
June 07, 2018
Filing Date:
November 29, 2016
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/027
Foreign References:
JP2008020629A2008-01-31
JP2001318461A2001-11-16
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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