PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME

Title:

PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME

Document Type and Number:

WIPO Patent Application WO/2007/043240

Kind Code:

A1

Abstract:

A photosensitive resin composition comprising (A) a binder polymer having a carboxyl group, (B) a photopolymerizable compound, (C) a photopolymerization initiator and (D) dicyandiamide and/or a derivative thereof, the photopolymerizable compound (B) comprising a compound (B1) which has an urethane bond and an ethylenically unsaturated group in the molecule and has a weight average molecular weight of 3500 to 100000.

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Inventors:

OHASHI TAKESHI (JP)
YOSHIDA TETSUYA (JP)
OOTOMO SATOSHI (JP)

Application Number:

PCT/JP2006/315659

Publication Date:

April 19, 2007

Filing Date:

August 08, 2006

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)
OHASHI TAKESHI (JP)
YOSHIDA TETSUYA (JP)
OOTOMO SATOSHI (JP)

International Classes:

C08F299/06; G03F7/027; G03F7/004; G03F7/033

Foreign References:

JPH08297368A	1996-11-12
JPH0695379A	1994-04-08
JP2005099647A	2005-04-14
JP2005024893A	2005-01-27

Attorney, Agent or Firm:

HASEGAWA, Yoshiki et al. (Ginza First Bldg. 10-6, Ginza 1-chome, Chuo-k, Tokyo 61, JP)

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