PLASMA PROCESSING DEVICE

WIPO Patent Application WO/2011/148629

A1

Disclosed is a plasma processing device (1) provided with a stock section (2), a processing chamber (5), and an alignment chamber (4). The stock section (2) supplies and recovers a transportable tray (7) in which wafers (W) are respectively accommodated in a plurality of accommodating holes (7a) that penetrate the tray (7) in the thickness direction. Plasma processing for the wafers (W) accommodated in the tray (7) supplied from the stock section (2) is carried out in the processing chamber (5). The alignment chamber (4) is provided with a rotary table (41) on which the tray (7) is mounted prior to plasma processing, and the wafers (W) are positioned on the rotary table (41). A wafer presence determination section (6a) of a control device (6) determines whether or not wafers (W) are present in the accommodating holes (7a) of the tray (7) mounted on the rotary table (41) in the alignment chamber (4), with said determination being performed in accordance with signals from wafer presence detection sensors (44A, 44B).

JPS605130	[Title of the device] The carrier for semiconductor wafers
JP6143135	An exposure device, an exposure method, and a device manufacturing method

OKITA SHOGO
MIYAKE SUMIO

PCT/JP2011/002908

December 01, 2011

May 25, 2011

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PANASONIC CORP (JP)
OKITA SHOGO
MIYAKE SUMIO

H01L21/68; H01L21/3065

JP2009177190A	2009-08-06
JPH03276092A	1991-12-06
JP2005142200A	2005-06-02
JP2009200142A	2009-09-03
JP2010153769A	2010-07-08

TANAKA, Mitsuo et al. (JP)
Mitsuo Tanaka (JP)

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