Title:
PLASMA PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/033754
Kind Code:
A1
Abstract:
Provided is a plasma processing method by which a body to be processed, in which an organic film, a mask film, and a resist film are stacked in the stated order, is processed by plasma, wherein the plasma processing method has the following: a step in which the body to be processed having a prescribed pattern formed on the resist film is conveyed into a chamber, and supplied into the chamber is a reforming gas that is H2 gas, halogenated hydrogen gas, or a mixed gas including halogenated hydrogen gas or a noble gas and H2 gas; and a reforming step for reforming the resist film of the body to be processed using a plasma of the reforming gas at a processing temperature of -20°C or less.
More Like This:
| JP2022032235 | ETCHING METHOD AND PLASMA PROCESSING DEVICE |
| JP6422907 | Semiconductor manufacturing equipment |
| JP2000353690 | PLASMA REACTOR APPARATUS |
Inventors:
OGAWA SHUHEI (JP)
PARK WANJAE (JP)
KIHARA YOSHIHIDE (JP)
HONDA MASANOBU (JP)
PARK WANJAE (JP)
KIHARA YOSHIHIDE (JP)
HONDA MASANOBU (JP)
Application Number:
PCT/JP2016/073648
Publication Date:
March 02, 2017
Filing Date:
August 10, 2016
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; H05H1/46
Foreign References:
| JP2014082475A | 2014-05-08 | |||
| JP2000221698A | 2000-08-11 | |||
| JP2005072518A | 2005-03-17 | |||
| JP2005243681A | 2005-09-08 | |||
| JPH06168918A | 1994-06-14 | |||
| JP2009267352A | 2009-11-12 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF:
Previous Patent: ELECTRIC VEHICLE CONTROL METHOD, AND CONTROL DEVICE
Next Patent: FLUID PRESSURE CYLINDER
Next Patent: FLUID PRESSURE CYLINDER