Title:
PLATING DEVICE AND PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/141496
Kind Code:
A1
Abstract:
Provided is a plating device that has: a frame body that has a shape surrounding an area to be plated; a conveyance part that conveys a substrate to a position below the frame body while supporting another main face of the substrate while the area to be plated is facing upward; an elevating part that raises the substrate relative to the frame body such that a storage space for storing a plating solution is formed by the frame body and the area to be plated; a supply part that supplies the plating solution to the storage space; a cathode electrode that is electrically connected to the area to be plated; and an anode electrode that is in contact with the plating solution stored in the storage space. Plating is carried out by passing a current between the cathode electrode and the anode electrode while the other main face of the substrate is supported from below by the elevating part and/or the conveyance part.
Inventors:
NISHIKIUCHI HISASHI (JP)
JODAI KAZUO (JP)
JODAI KAZUO (JP)
Application Number:
PCT/JP2016/081539
Publication Date:
August 24, 2017
Filing Date:
October 25, 2016
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
C25D17/06; C25D5/02; C25D7/12; C25D17/00; H01L21/304
Domestic Patent References:
| WO2001068952A1 | 2001-09-20 |
Foreign References:
| JP2010238782A | 2010-10-21 | |||
| JP2004052108A | 2004-02-19 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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