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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/131450
Kind Code:
A1
Abstract:
Provided is a polishing composition capable of reducing device vibrations. This polishing composition comprises colloidal silica, a water-soluble polymer, a basic compound, water, and a vibration suppression agent which is a polymer having an ethylene oxide group and a weight average molecular weight of 1,500 to 30,000. The molar concentration of the vibration suppression agent is 6.9 × 10-10 mol/g or higher. The product of the mass concentration of the vibration suppression agent and the weight average molecular weight of the ethylene oxide group portion per molecule of the vibration suppression agent is 8.0 × 10-2 or greater. In the vibration suppression agent, the proportion occupied by the ethylene oxide group within alkylene oxide groups is 80% or greater in terms of weight average molecular weight.

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Inventors:
YAMASAKI TOMOKI (JP)
MAKINO HIROSHI (JP)
Application Number:
PCT/JP2018/047029
Publication Date:
July 04, 2019
Filing Date:
December 20, 2018
Export Citation:
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Assignee:
NITTA HAAS INC (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
WO2017150118A12017-09-08
Foreign References:
JP2015174918A2015-10-05
JP2016124943A2016-07-11
Attorney, Agent or Firm:
UEBA Hidetoshi et al. (JP)
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