Title:
POLYIMIDE FILM AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/102449
Kind Code:
A1
Abstract:
Provided are a colorless polyimide film which is high in tensile rupture strength and tensile modulus and has a high elongation at rupture and a low coefficient of linear expansion and a method for producing the polyimide film. The polyimide film is a multilayered polyimide film having a thickness of 3-120 μm, a yellowness index of 5 or less, and a total light transmittance of 86% or greater, characterized by having a multilayer structure in which at least two polyimide layers differing in composition have been superposed in the thickness direction and in that the two polyimide layers include an (a) layer and a (b) layer, the (a) layer having a film thickness of 0.3 μm or larger and the (b) layer having a film thickness 5-25 times that of the (a) layer.
More Like This:
Inventors:
YONEMUSHI HARUMI (JP)
NAKAMURA MAKOTO (JP)
OKUYAMA TETSUO (JP)
MAEDA SATOSHI (JP)
WATANABE NAOKI (JP)
MIZUGUCHI DENICHIROU (JP)
WAKUI HIROYUKI (JP)
NAKAMURA MAKOTO (JP)
OKUYAMA TETSUO (JP)
MAEDA SATOSHI (JP)
WATANABE NAOKI (JP)
MIZUGUCHI DENICHIROU (JP)
WAKUI HIROYUKI (JP)
Application Number:
PCT/JP2021/040228
Publication Date:
May 19, 2022
Filing Date:
November 01, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08J5/18; B32B27/34; C08G73/10; C08J7/04; H05K1/03
Domestic Patent References:
| WO2016129329A1 | 2016-08-18 | |||
| WO2018186262A1 | 2018-10-11 | |||
| WO2020262450A1 | 2020-12-30 |
Foreign References:
| JP2019515819A | 2019-06-13 |
Download PDF: