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Title:
POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2023/190749
Kind Code:
A1
Abstract:
The present invention provides a polyimide precursor composition for flexible wiring boards, the polyimide precursor composition containing a polyimide precursor that has a repeating unit represented by general formula (I). A polyimide film, which has a low dielectric loss tangent in a high frequency region and excellent alkali resistance at the same time, can be produced using this polyimide precursor composition. In the formula, 70% by mole to 90% by mole of the X1 moiety is a group represented by formula (21), while 10% by mole to 30% by mole thereof is a group represented by formula (22) and/or a group represented by formula (23); 45% by mole to 100% by mole of the Y1 moiety is a structure represented by formula (1). In formula (1), A represents a structure represented by formula (A); n represents a number of 1 to 4; m represents a number of 0 to 4; B represents an alkyl group having 1 to 6 carbon atoms, or the like; and U represents -CO-O- or -O-CO-.

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Inventors:
YAMAJI KOSUKE (JP)
IIZUMI NOBU (JP)
FUKATA HIROTO (JP)
IWAMOTO KEIJI (JP)
Application Number:
PCT/JP2023/012958
Publication Date:
October 05, 2023
Filing Date:
March 29, 2023
Export Citation:
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Assignee:
UBE CORP (JP)
International Classes:
C08G73/10; B32B15/088; B32B27/34; C08J5/18
Domestic Patent References:
WO2017051827A12017-03-30
WO2021166572A12021-08-26
Foreign References:
JPH11199668A1999-07-27
JP2019210342A2019-12-12
JP2022041946A2022-03-11
CN112679735A2021-04-20
JP2018201024A2018-12-20
JP2020015237A2020-01-30
JP2021195393A2021-12-27
JP2007246709A2007-09-27
JP2021074894A2021-05-20
Attorney, Agent or Firm:
ITO Katsuhiro (JP)
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