Title:
POLYPROPYLENE FILM, POLYPROPYLENE FILM INTEGRATED WITH METAL LAYER, AND FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2022/107706
Kind Code:
A1
Abstract:
Provided is a polypropylene film having a high dielectric breakdown strength at high temperatures. Provided is a polypropylene film in which a polypropylene resin constituting the polypropylene film has a molecular-weight distribution (Mw/Mn) of the weight-average molecular weight Mw to the number-average molecular weight Mn of 5.0-6.9, has a Z-average molecular weight Mz of 950,000-1,500,000, and has a weight proportion w of 2.6-4.2% in an integral molecular-weight distribution curve when the logarithmic molecular weight Log(M) is 4.0.
Inventors:
ISHIDA TATSUJI (JP)
TOMINAGA TAKESHI (JP)
ISHIWATA TADAKAZU (JP)
TOMINAGA TAKESHI (JP)
ISHIWATA TADAKAZU (JP)
Application Number:
PCT/JP2021/041831
Publication Date:
May 27, 2022
Filing Date:
November 15, 2021
Export Citation:
Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
C08J5/18; B32B15/08; B32B15/085; H01G4/32
Domestic Patent References:
| WO2020045482A1 | 2020-03-05 | |||
| WO2020217930A1 | 2020-10-29 | |||
| WO2018181938A1 | 2018-10-04 | |||
| WO2019022004A1 | 2019-01-31 | |||
| WO2015022003A1 | 2015-02-19 | |||
| WO2018056404A1 | 2018-03-29 |
Foreign References:
| JP2007246898A | 2007-09-27 | |||
| JP2016012705A | 2016-01-21 | |||
| JP2017101229A | 2017-06-08 | |||
| JP2020100800A | 2020-07-02 | |||
| JP2017057247A | 2017-03-23 |
Other References:
"4.2.4 Insulation resistance", JIS C, vol. 5101, 2009, pages 16
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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