POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND PARTITION WALL OF ORGANIC ELECTROLUMINESCENT ELEMENT

WIPO Patent Application WO/2021/246449

A1

Provided is a high-sensitivity photosensitive resin composition that has improved process stability and contains a black colorant. This positive photosensitive resin composition includes: a resin blend (A2) that includes a resin (a2-1) having a plurality of phenolic hydroxyl groups, X mol% (where X is a real number greater than 0) of the plurality of phenolic hydroxyl groups being protected by an acid-degradable group (4), and a resin (a2-2) having a plurality of phenolic hydroxyl groups, Y mol% (where Y is a real number greater than 0) of the plurality of phenolic hydroxyl groups being protected by the same acid-degradable group (4); at least one type of colorant (B) selected from the group consisting of black dyes and black pigments; and a photoacid generator (C), wherein Y – X ≥ 10.

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WO/2014/042288	ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE
JP4828201	Chemically amplified resist composition, resist layer laminate and resist pattern forming method

ARAI YOSHIKAZU (JP)
KURAMOTO HIROKI (JP)
NISHIZAWA SHOHEI (JP)

PCT/JP2021/021047

December 09, 2021

June 02, 2021

Click for automatic bibliography generation  

SHOWA DENKO KK (JP)

G03F7/004; G03F7/039; H01L51/50; H05B33/02; H05B33/12; H05B33/22

JP2014010382A	2014-01-20
JP2019202974A	2019-11-28
JP2020037544A	2020-03-12
JP2015018131A	2015-01-29
JP2008102277A	2008-05-01

AOKI, Atsushi et al. (JP)

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