Title:
PREPREG AND PRINTED WIRING BOARD INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2012/093860
Kind Code:
A2
Abstract:
The present invention relates to a prepreg formed by impregnating a resin composition into a substrate formed of glass fiber containing 60-74 wt% of silica, and a printed wiring board including the prepreg, wherein the resin composition comprises (a) an epoxy resin having two or more epoxy groups within one molecule, (b) a curing agent, a curing accelerator or both, and (c) an inorganic filler containing nanosilica and micro inorganic filler.
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| WO/2016/178400 | METHOD FOR PRODUCING FRP PRECURSOR AND DEVICE FOR PRODUCING SAME |
| WO/2018/003694 | PREPREG AND PRODUCTION METHOD THEREFOR |
| WO/2014/061812 | RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED WIRING BOARD |
Inventors:
JUNG SOO IM (KR)
SHIN JU HO (KR)
CHO KYEONG WOON (KR)
SHIN JU HO (KR)
CHO KYEONG WOON (KR)
Application Number:
PCT/KR2012/000098
Publication Date:
July 12, 2012
Filing Date:
January 04, 2012
Export Citation:
Assignee:
DOOSAN CORP (KR)
JUNG SOO IM (KR)
SHIN JU HO (KR)
CHO KYEONG WOON (KR)
JUNG SOO IM (KR)
SHIN JU HO (KR)
CHO KYEONG WOON (KR)
International Classes:
C08J5/24; B29B11/16; C08K3/36; C08L63/00; H05K1/03
Domestic Patent References:
| WO2010035452A1 | 2010-04-01 |
Foreign References:
| KR930000206B1 | 1993-01-14 | |||
| US20080200084A1 | 2008-08-21 |
Attorney, Agent or Firm:
KIM, Kee Hyo (KR)
김기효 (KR)
김기효 (KR)
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Claims: