Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/095664
Kind Code:
A1
Abstract:
A pressure-sensitive adhesive composition for constituting a pressure-sensitive adhesive sheet (5) comprises a (meth)acrylic polymer having a weight-average molecular weight of 250,000-500,000, a crosslinking agent, and a polyfunctional compound having two or more polymerizable functional groups. The polyfunctional compound has a bisphenol structure. The content of the polyfunctional compound in the pressure-sensitive adhesive composition is preferably 2-17 parts by weight per 100 parts by weight of the (meth)acrylic polymer. The pressure-sensitive adhesive sheet (5) can have excellent space-filling properties even in application to fine patterned wiring.
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Inventors:
KATAOKA KENICHI (JP)
ISHII YUMIKO (JP)
FUNAKI CHIHIRO (JP)
ISHII YUMIKO (JP)
FUNAKI CHIHIRO (JP)
Application Number:
PCT/JP2022/042258
Publication Date:
June 01, 2023
Filing Date:
November 14, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J4/02; C09J7/38; C09J11/00; C09J11/06; C09J131/00; C09J201/02
Domestic Patent References:
| WO2020230875A1 | 2020-11-19 | |||
| WO2019131888A1 | 2019-07-04 |
Foreign References:
| JP2020012044A | 2020-01-23 | |||
| JP2005097386A | 2005-04-14 | |||
| JP2021075614A | 2021-05-20 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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