Title:
PRESSURE SENSOR MODULE AND PRESSURE DETECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/104860
Kind Code:
A1
Abstract:
Provided is a pressure detection device which uses a reduced number of parts to make the device low profile and which can be assembled with reduced man-hours. Also provided is a pressure sensor module which, in the temperature range from 60˚C or below to minus 50˚C or above, normally operates and has satisfactory accuracy. The pressure sensor module is provided with: a ceramic substrate in which a pressure introduction hole is formed and which has a thermal expansion coefficient of 10 × 10-6 or below; a semiconductor pressure sensor chip normally operating even at a temperature of minus 40˚C or below and joined to the ceramic substrate, in which the pressure introduction hole is formed, by an adhesive agent having elasticity even at a temperature of minus 40˚C or below; an electronic circuit mounted on the ceramic substrate and amplifying the output voltage of the semiconductor pressure sensor chip; a wiring pattern formed on the ceramic substrate using a material having electrical properties which change a little even at a temperature of minus 40˚C or below; and a capacitor for removing noise, joined to the wiring pattern and operating normally even at a temperature of minus 40˚C or below.
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Inventors:
OONUMA YOSHINORI (JP)
SHIRATA TAKUYA (JP)
SHIRATA TAKUYA (JP)
Application Number:
PCT/JP2010/053078
Publication Date:
September 01, 2011
Filing Date:
February 26, 2010
Export Citation:
Assignee:
NABTESCO CORP (JP)
OONUMA YOSHINORI (JP)
SHIRATA TAKUYA (JP)
OONUMA YOSHINORI (JP)
SHIRATA TAKUYA (JP)
International Classes:
G01L19/14; G01L19/06
Foreign References:
| JPH09280988A | 1997-10-31 | |||
| JP2005079506A | 2005-03-24 | |||
| JPH08233848A | 1996-09-13 | |||
| JP2003232693A | 2003-08-22 | |||
| JPH05243753A | 1993-09-21 | |||
| JP2001235383A | 2001-08-31 |
Attorney, Agent or Firm:
NABTESCO CORPORATION (JP)
Nabtesco Corp. (JP)
Nabtesco Corp. (JP)
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Claims:
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