PRIMER COMPOSITION FOR PLATING, BASE TO BE PLATED, COMPOSITE BODY OF INSULATING BASE AND METAL LAYER, METHOD FOR PRODUCING BASE TO BE PLATED, AND METHOD FOR PRODUCING COMPOSITE BODY OF INSULATING BASE AND METAL LAYER

Title:

Document Type and Number:

WIPO Patent Application WO/2016/098680

Kind Code:

A1

Abstract:

The present invention provides a primer composition for plating, which is characterized by containing (A) metal nanoparticles of at least one kind selected from the group consisting of silver nanoparticles, copper nanoparticles, silver core-copper shell nanoparticles and silver-copper anisotropic composite particles, (B) a blocked isocyanate and (C) a solvent. By using this primer composition for plating, a metal layer which exhibits high adhesion is able to be formed on an insulating base at low cost by a simple plating process without performing surface roughening.

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Inventors:

INOUE NAOTO (JP)
FUKAZAWA NORIMASA (JP)
SANO YOSHIYUKI (JP)

Application Number:

PCT/JP2015/084646

Publication Date:

June 23, 2016

Filing Date:

December 10, 2015

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS (JP)

International Classes:

C23C18/20; B05D7/24; B32B27/20; B32B27/40; C25D5/56; H05K3/18

Domestic Patent References:

WO2012157701A1

2012-11-22

Foreign References:

JP2013243045A	2013-12-05
JP2012045470A	2012-03-08
JP2000239853A	2000-09-05
JP2014196556A	2014-10-16
JP2014205905A	2014-10-30
JPH11138729A	1999-05-25

Attorney, Agent or Firm:

KONO MICHIHIRO (JP)
Michihiro Kono (JP)

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