Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/084994
Kind Code:
A1
Abstract:
A printed wiring board comprising: an insulating layer having a first main surface and a second main surface; a first copper layer disposed on the first main surface; a second copper layer disposed on the second main surface; and a third copper layer. The insulating layer and the first copper layer have a through-hole reaching the second copper layer. The third copper layer lies on the second copper layer inside the through-hole, on the inner-wall surface of the through-hole, and on the first copper layer surrounding the through-hole. A single copper layer has been disposed on the inner-wall surface of the through-hole, and the single copper layer is some of the third copper layer.
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Inventors:
MIURA KOUSUKE (JP)
NITTA KOJI (JP)
SAKAI SHOICHIRO (JP)
OKA YOSHIO (JP)
KASUGA TAKASHI (JP)
YAMAGUCHI YOSHIHITO (JP)
NITTA KOJI (JP)
SAKAI SHOICHIRO (JP)
OKA YOSHIO (JP)
KASUGA TAKASHI (JP)
YAMAGUCHI YOSHIHITO (JP)
Application Number:
PCT/JP2023/036476
Publication Date:
April 25, 2024
Filing Date:
October 06, 2023
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K3/42; H05K3/46
Foreign References:
| EP2566311A1 | 2013-03-06 | |||
| JP2009094191A | 2009-04-30 | |||
| JP2001144441A | 2001-05-25 |
Attorney, Agent or Firm:
MORITA Takeshi et al. (JP)
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