Title:
PRODUCTION METHOD AND DEVICE FOR IMPROVING THE BONDING BETWEEN PLASTIC AND METAL
Document Type and Number:
WIPO Patent Application WO2005041272
Kind Code:
A3
Abstract:
A flat conductor frame for fitting with a semiconductor chip (2) and for covering with a plastic mass (4) has a single-piece, metal base body (3) on which an intermediate layer (5) is applied. The intermediate layer (5) has a surface (6) with a matrix of islands (14) of leftover materials having substantially a uniform height and cavities (10) extending therebetween.
Inventors:
BETZ BERND (DE)
DANGELMAIER JOCHEN (DE)
PAULUS STEFAN (DE)
DANGELMAIER JOCHEN (DE)
PAULUS STEFAN (DE)
Application Number:
PCT/DE2004/002199
Publication Date:
July 21, 2005
Filing Date:
October 01, 2004
Export Citation:
Assignee:
INFINEON TECHNOLOGIES AG (DE)
BETZ BERND (DE)
DANGELMAIER JOCHEN (DE)
PAULUS STEFAN (DE)
BETZ BERND (DE)
DANGELMAIER JOCHEN (DE)
PAULUS STEFAN (DE)
International Classes:
H01L21/48; H01L23/495; (IPC1-7): H01L23/495
Foreign References:
| EP0533137A2 | 1993-03-24 | |||
| EP1191590A2 | 2002-03-27 | |||
| US5554569A | 1996-09-10 |
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