Title:
PRODUCTION METHOD FOR MULTILAYER PRINTED WIRING BOARD, AND BASE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/054803
Kind Code:
A1
Abstract:
A production method for a base material used in the production of a multilayer printed wiring board includes: a step in which a resin, plate-like carrier is prepared; and a step in which, either a stacked body having a mould-release-agent layer stacked upon a metal foil therein is stacked upon at least one main surface of the plate-like carrier, or the mould-release-agent layer is stacked upon the metal foil which has already been stacked upon the at least one main surface of the plate-like carrier, so that the mould-release-agent layer is stacked upon the main surface of the plate-like carrier, with the metal foil located therebetween.
Inventors:
MORIYAMA TERUMASA (JP)
KOHIKI MICHIYA (JP)
ISHII MASAFUMI (JP)
KOHIKI MICHIYA (JP)
ISHII MASAFUMI (JP)
Application Number:
PCT/JP2013/077167
Publication Date:
April 10, 2014
Filing Date:
October 04, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
H05K3/46; C09K3/00
Foreign References:
| JP2011009686A | 2011-01-13 | |||
| JP2007173658A | 2007-07-05 | |||
| JP2011029585A | 2011-02-10 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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