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Title:
RESIN COMPOSITION, FILM, CARD, AND PASSPORT
Document Type and Number:
WIPO Patent Application WO/2023/228804
Kind Code:
A1
Abstract:
A resin composition comprising: a resin component including a polycarbonate resin (A) having a structural unit (A1) derived from a dihydroxy compound having, as some of the structure, a portion represented by formula (1); and a stabilizer based on a metal salt. The dihydroxy compound is not one in which the portion represented by formula (1) is some of -CH2-O-H.

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Inventors:
TEZUKA RIE (JP)
Application Number:
PCT/JP2023/018171
Publication Date:
November 30, 2023
Filing Date:
May 15, 2023
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L69/00; C08G64/00; C08K5/098
Foreign References:
JP2016113563A2016-06-23
JP2019172879A2019-10-10
JP2013194086A2013-09-30
JP2014051558A2014-03-20
JP2022034100A2022-03-03
JP2012030574A2012-02-16
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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