Title:
RESIN COMPOSITION AND FILM FORMED OF SAID RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/016306
Kind Code:
A1
Abstract:
Provided are: a resin composition which is not susceptible to the occurrence of birefringence, while having excellent heat resistance, film strength and thermal stability; and a film which is formed of this resin composition.
The present invention provides a resin composition which is composed of 17-31% by mass of an aromatic vinyl monomer unit (A), 38-63% by mass of a (meth)acrylic acid ester monomer unit (B), 4-14% by mass of an unsaturated dicarboxylic acid anhydride monomer unit (C) and 4-25% by mass of a conjugated diene monomer unit (D), and wherein the absolute value of formula 1 is 0.005 or less. In formula 1, [A], [B], [C] and [D] respectively represent the mass ratios of the aromatic vinyl monomer unit (A), the (meth)acrylic acid ester monomer unit (B), the unsaturated dicarboxylic acid anhydride monomer unit (C) and the conjugated diene monomer unit (D) in the resin composition; and [A] + [B] + [C] + [D] = 1.
Formula 1 -0.10 × [A] - 0.004 × [B] + 0.10 × [C] + 0.09 × [D]
Inventors:
MATSUMOTO MASANORI (JP)
NOGUCHI TETSUO (JP)
NOGUCHI TETSUO (JP)
Application Number:
PCT/JP2017/024299
Publication Date:
January 25, 2018
Filing Date:
July 03, 2017
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L33/06; C08J5/18; C08L51/04
Domestic Patent References:
| WO2016024553A1 | 2016-02-18 |
Foreign References:
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Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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