RESIN COMPOSITION, MULTILAYERED STRUCTURE, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION

Title:

RESIN COMPOSITION, MULTILAYERED STRUCTURE, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2023/228970

Kind Code:

A1

Abstract:

As a resin composition having excellent thermal stability, provided is a resin composition which comprises an ethylene-vinyl alcohol-based copolymer (A) and lycopene (B).

More Like This:

JP4229850	Water-dispersed water-repellent oil-repellent composition and water-repellent oil-repellent paper treated with it
JP6558063	Hollow fiber membrane module and its manufacturing method
JPH069845	AQUEOUS SUSPENSION OF POLYVINYL ALCOHOL

Inventors:

TERAOKA KOTA (JP)

Application Number:

PCT/JP2023/019304

Publication Date:

November 30, 2023

Filing Date:

May 24, 2023

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MITSUBISHI CHEM CORP (JP)

International Classes:

C08L29/04; B32B27/28; C08K5/01; C08L23/00

Domestic Patent References:

WO2005014716A1

2005-02-17

Foreign References:

JP2014007975A	2014-01-20
JP2022512966A	2022-02-07
JP2012526807A	2012-11-01

Attorney, Agent or Firm:

SAITOH Yukihiko et al. (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: FILAMENTOUS FUNGUS FOR USE IN GENE TRANSFER

Next Patent: IGA NEPHROPATHY PREVENTATIVE/THERAPEUTIC AGENT