RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD

Title:

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2020/017399

Kind Code:

A1

Abstract:

One aspect of the present invention is a resin composition which is characterized by containing: a compound (A) that has at least one group represented by general formula (1) in each molecule; and an acenaphthylene compound (B). In formula (1), n represents a number of 0-10; Z represents an arylene group; and each of R1-R3 independently represents a hydrogen atom or an alkyl group.

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Inventors:

SATO MIKIO
KITAI YUKI
HOSHINO YASUNORI
KODA MASASHI
WADA ATSUSHI

Application Number:

PCT/JP2019/027186

Publication Date:

January 23, 2020

Filing Date:

July 09, 2019

Export Citation:

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Assignee:

PANASONIC IP MAN CO LTD (JP)

International Classes:

B32B27/00; C08F290/06; C08F257/02; C08F290/12; C08J5/24; C08G65/48

Domestic Patent References:

WO2016104748A1

2016-06-30

Foreign References:

JP2004131639A	2004-04-30
JP2006516297A	2006-06-29
JP2016113543A	2016-06-23
JP2017025228A	2017-02-02
JP2018039995A	2018-03-15

Attorney, Agent or Firm:

KOTANI, Etsuji et al. (JP)

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