Title:
RESIN COMPOSITION FOR SEALING SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/150487
Kind Code:
A1
Abstract:
Provided is a resin composition for sealing semiconductors comprising a hardening agent, an epoxy resin (B), and an inorganic filler (C), that is characterized in that the hardening agent is a phenolic resin (A) with a predetermined structure. Also provided is a semiconductor device characterized in that a semiconductor element can be obtained by being sealed with the hardened material of the resin composition for sealing semiconductors.
Inventors:
WADA MASAHIRO (JP)
Application Number:
PCT/JP2010/003990
Publication Date:
December 29, 2010
Filing Date:
June 16, 2010
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
WADA MASAHIRO (JP)
WADA MASAHIRO (JP)
International Classes:
C08G59/62; C08K3/00; C08L63/00; C08L65/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2007007827A1 | 2007-01-18 |
Foreign References:
| JPH11255688A | 1999-09-21 | |||
| JP2004123859A | 2004-04-22 | |||
| JP2004059792A | 2004-02-26 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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