Title:
RESIN COMPOSITION FOR SEALING USE
Document Type and Number:
WIPO Patent Application WO/2023/068239
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide a resin composition for sealing use, which has a low viscosity, can be cured into a cured article having a high refractive index, and has low outgassing properties and transparency. Another purpose of the present invention is to provide a coating layer and a film each formed using the resin composition for sealing use. The present invention is a resin composition for sealing use, comprising a curable resin and a polymerization initiator, in which the curable resin comprises a compound (A) that has a biphenyl backbone and a polymerizable functional group, has a refractive index of 1.55 or more and has a liquid form at 25°C and a compound (B) that has at least one backbone selected from the group consisting of a fluorene backbone, a naphthol backbone and a naphthothiophene backbone and a polymerizable functional group and has a refractive index of 1.60 to 1.80 inclusive.
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Inventors:
UCHINO SHINYA (JP)
Application Number:
PCT/JP2022/038653
Publication Date:
April 27, 2023
Filing Date:
October 18, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; C08L63/00; G02B1/04; H01L23/02
Domestic Patent References:
| WO2013183532A1 | 2013-12-12 |
Foreign References:
| US7446159B1 | 2008-11-04 | |||
| JP2010163566A | 2010-07-29 | |||
| JP2014108983A | 2014-06-12 | |||
| JP2008094987A | 2008-04-24 | |||
| JP2005181955A | 2005-07-07 | |||
| JP2007277467A | 2007-10-25 | |||
| JP2007002073A | 2007-01-11 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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