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Title:
RESIN FOR ELECTRICAL COMPONENTS, SEMICONDUCTOR DEVICE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/076909
Kind Code:
A1
Abstract:
This semiconductor device, which serves as a structure in which a resin is packaged by sealing a semiconductor element (T1) with a first resin (6), has a filler (7) mixed in with the first resin (6), said filler (7) encapsulating a phase-change material, wherein a dielectric voltage rises as a result of a phase change brought about by absorbing ambient heat, in a capsule with electrical insulating properties. A high voltage structure with good heat dissipation performance is achieved due to the action of the filler (7).

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Inventors:
MINAMIO MASANORI
IKEUCHI HIROKI
Application Number:
PCT/JP2012/006652
Publication Date:
May 30, 2013
Filing Date:
October 18, 2012
Export Citation:
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Assignee:
PANASONIC CORP (JP)
International Classes:
H01L23/29; H01L23/31; H05K1/03; H05K3/46
Domestic Patent References:
WO2010074970A22010-07-01
Foreign References:
JP2009029962A2009-02-12
JP2003100969A2003-04-04
JPS56137098A1981-10-26
JP2008004688A2008-01-10
US6848500B12005-02-01
Other References:
See also references of EP 2784808A4
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (JP)
Patent business corporation Morimoto international patent firm (JP)
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