Title:
RESIN-SEALED MODULE, OPTICAL MODULE AND METHOD OF RESIN SEALING
Document Type and Number:
WIPO Patent Application WO/2007/148398
Kind Code:
A1
Abstract:
A resin-sealed module that even when a resin sealing is carried out astride mounted
members having different linear expansion coefficients, is free from damaging
by temperature change; and a relevant optical module and method of resin sealing.
There is provided resin-sealed module (400) having mounted member (411) and
mounted member (412) as mounted members having different linear expansion coefficients,
wherein part (421) is sealed by means of sealing resin (441) lest the sealing region
reach the mounted member (412), and wherein exposed portion of bonding wire (432)
is sealed by means of sealing resin (442) with low Young's modulus.
Inventors:
TERADA KOJI (JP)
MATSUI JUN (JP)
NOBUHARA HIROYUKI (JP)
MATSUI JUN (JP)
NOBUHARA HIROYUKI (JP)
Application Number:
PCT/JP2006/312510
Publication Date:
December 27, 2007
Filing Date:
June 22, 2006
Export Citation:
Assignee:
FUJITSU LTD (JP)
TERADA KOJI (JP)
MATSUI JUN (JP)
NOBUHARA HIROYUKI (JP)
TERADA KOJI (JP)
MATSUI JUN (JP)
NOBUHARA HIROYUKI (JP)
International Classes:
H01L21/56; H01L23/29; H01L23/31; H01L25/16; H01S5/022
Foreign References:
| JPH05175375A | 1993-07-13 | |||
| JPH11354687A | 1999-12-24 | |||
| JPH04188656A | 1992-07-07 | |||
| JPH0829648A | 1996-02-02 | |||
| JPH0829646A | 1996-02-02 | |||
| JPH0722576A | 1995-01-24 |
Attorney, Agent or Firm:
SAKAI, Hiroaki (Kasumigaseki Building2-5, Kasumigaseki 3-chom, Chiyoda-ku Tokyo 19, JP)
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