Title:
RFID TAG AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/131215
Kind Code:
A1
Abstract:
[Problem] To provide an RFID tag including an inlay which is thin and easy to manufacture. [Solution] The above problem is solved by an RFID tag 10 including an inlay 15 in which an IC chip 12 and an antenna are provided in a base material 11 having a main surface, wherein the antenna includes a loop conductive portion 13 having both ends connected to the IC chip 12 so as to form a loop via the IC chip 12, and a dipole antenna portion 14 disposed so as to surround the loop conductive portion 13 with an inductively coupled interval, the loop conductive portion 13 and the dipole antenna portion 14 are formed on the main surface so as to have the same thickness from a front main surface, and the IC chip 12 is disposed on both ends of the loop conductive portion 13.
Inventors:
SHIMADA TAKURO (JP)
KAN ALINA (JP)
KAN ALINA (JP)
Application Number:
PCT/JP2021/045844
Publication Date:
June 23, 2022
Filing Date:
December 13, 2021
Export Citation:
Assignee:
DAIO SEISHI KK (JP)
International Classes:
G06K19/077; H01Q9/16
Domestic Patent References:
| WO2009011041A1 | 2009-01-22 | |||
| WO2020020530A1 | 2020-01-30 |
Foreign References:
| JP2006285911A | 2006-10-19 | |||
| US20060044769A1 | 2006-03-02 | |||
| US20170162952A1 | 2017-06-08 | |||
| JP2008107947A | 2008-05-08 |
Attorney, Agent or Firm:
NAGAI INTERNATIONAL PATENT BUREAU (JP)
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