Title:
SELECTIVE APATITE FILM FORMING METHOD USING LASER AND SELECTIVE APATITE FILM FORMING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/019344
Kind Code:
A1
Abstract:
The present invention provides a selective apatite film forming method using a laser and a selective apatite film forming apparatus, the selective apatite film forming method comprising the steps of: (a) immersing an implant substrate in an apatite-forming precursor solution including Ca2+ ions and PO4 3- ions; (b) irradiating laser beams to the implant substrate immersed in the precursor solution; (c) generating a difference in the energy density of the laser beams that reach screw crest portions and screw root portions by positioning the foci of the laser beams on a specific part of the implant substrate; and (d) forming an apatite film in areas into which the laser beams are irradiated as the reaction of Ca2+ ions and PO4 3- ions in the precursor solution is activated.
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Inventors:
LEE SANG YUN (KR)
Application Number:
PCT/KR2023/008674
Publication Date:
January 25, 2024
Filing Date:
June 22, 2023
Export Citation:
Assignee:
DENTALPHAGO CO LTD (KR)
International Classes:
A61C8/00; A61L27/06; A61L27/32; C01B25/32; H01S3/00
Foreign References:
| KR102322536B1 | 2021-11-09 | |||
| KR101144273B1 | 2012-05-11 | |||
| KR101904017B1 | 2018-10-04 | |||
| JP2016202709A | 2016-12-08 | |||
| KR20200026475A | 2020-03-11 | |||
| KR102480199B1 | 2022-12-22 |
Attorney, Agent or Firm:
NURY PATENT LAW FIRM (KR)
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