SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Title:

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2015/059989

Kind Code:

A1

Abstract:

This method for manufacturing a semiconductor device comprises: a preparation step for preparing a plurality of semiconductor elements which are mounted on a substrate so as to be separated from each other in a first direction; and a sealing step for sealing the plurality of semiconductor elements with a plurality of sealing layers containing particles so that one semiconductor element is sealed with one sealing layer in such a manner that the sealing layers are separated from each other in the first direction.

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Inventors:

OOYABU YASUNARI (JP)
NINOMIYA AKITO (JP)

Application Number:

PCT/JP2014/071564

Publication Date:

April 30, 2015

Filing Date:

August 18, 2014

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Assignee:

NITTO DENKO CORP (JP)

International Classes:

H01L33/50; H01L23/29; H01L23/31; H01L33/52

Foreign References:

JP2009038315A	2009-02-19
JP2013506985A	2013-02-28
JP2013136671A	2013-07-11

Attorney, Agent or Firm:

OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)

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